Every day, fake electrical parts find their way into various markets, but happily, there are techniques the authorities can use to identify incoming counterfeit goods. We’ll discuss the multiple methods for electronic component examination in this article.
DNA marking, which refers to distinctive marks that have been applied by the manufacturer but cannot be imitated by anyone else, can be used to test electronic components. The Department of Defense demands DNA labeling on all of its high-risk microcircuitries.
X-ray inspection is another widely used technique for examining electronic components. A sample of an authentic item is used in X-ray examinations to compare the internal structure of arriving parts. You’d be astonished to learn that while counterfeit goods may appear genuine to the naked eye, they differ from natural internal components like wire bonding or die frames.
Another strategy for reducing the influx of fake goods is X-RF inspection. An X-ray fluorescence spectroscopy equipment is used in X-RF inspection to verify a part’s validity.
Through decapsulation, counterfeit device inspection is another technique. Typically, this technique is used to test semiconductors. Decapsulation entails removing the semiconductor wafer’s outer packing so that laser die etching and authentication markings can be applied.
Chemical procedures, which disclose counterfeits by heating acid, and mechanical methods, which include physically breaking, chopping, and cutting components, are two other techniques for inspecting fake goods.
And there are numerous other ways to distinguish between genuine and fraudulent components. Remember that counterfeit goods can be created in various methods, such as by sanding and remarking, blacktopping and remarking screening, and re-balling things from no-lead to led without the OEM’s consent.
Manufacturers and governmental organizations continually develop new techniques to identify fake components. The most recent of these techniques are:
Parametric Testing or Curve Tracing, which verifies whether a product sample has the same electrical properties as the original, and Scanning Acoustic Microscopy, or SAM, which detects laser etching beneath blacktop material.
The dot-com boom, outsourcing and offshoring of manufacturing operations, the ease of information sharing on the Internet, China’s admission to the World Trade Organization, and shipping firms like FedEx that don’t check small items are just a few of the causes of the entry of counterfeit goods into the market.
Through decapsulation, counterfeit device inspection is another technique. Typically, this technique is used to test semiconductors. Decapsulation entails removing the semiconductor wafer’s outer packing so that laser die etching and authentication markings can be applied.
However, the United States’ ongoing practice of exporting its e-waste to China and other developing nations may have had the most significant impact on the explosion in counterfeit businesses. E-waste serves as the raw material for creating fake goods. Most industrialized nations around the globe ratified the Basel Convention. This treaty forbade the export of e-waste to developing countries, in the latter part of 1989, except for the United States and a small number of other nations.
